Titlebook: Nanopackaging: From Nanomaterials to the Atomic Scale; Proceedings of the 1 Xavier Baillin,Christian Joachim,Gilles Poupon Conference proce

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Utilization of Peridynamic Theory for Modeling at the Nano-Scale,echanics (CCM) and Molecular Dynamics (MD). Due to its length-scale parameter, horizon, it is capable of capturing phenomena occurring at different length scales, including the nano-scale. Furthermore, van der Waals forces can be represented in a straightforward manner using a buffer-layer approach.

鐵砧

某人

Direct Integration of Carbon Nanotubes in Si Microsystems,l properties in real devices. However, the CNT-to-microsystem integration is challenging to implement in a manufacturable, cost-effective industrial process. This text presents our work towards a process for making complete CMOS/MEMS systems with integrated CNTs. We demonstrate the feasibility of th

Noctambulant

Nanopackaging Requests for Atomic Scale Circuits and Molecule-Machines,ossible architectures of an atomic scale Boolean logic circuit are discussed in the prospect to be supported by such a surface and encapsulated at the end of the fabrication process. This leads to look after the best possible interconnection strategy to beneficiate from the possibly large calculatin

雀斑

Antimicrobial

Site-Selective Self-Assembly of Nano-Objects on a Planar Substrate Based on Surface Chemical Functie chemistry, we can enable whole sets of different nano-objects to be selectively deposited onto well-defined submicronic anchoring sites on macroscopic substrates. This potentially enables the development of unprecedented systems in different fields such as electronics, photonics or biosensors.

Psychogenic

Silicon Technologies for Nanoscale Device Packaging,tecting and electrically connecting a nanoscale device positioned on a perfect Si(001)-(2?×?1):H surface smoothed thanks to a 950?°C thermal treatment. The nano-device is connected to nanopads implanted on the silicon surface. Each nanopad is linked to a nanovia which is locally achieved by etching

Preamble

Designing Carbon Nanotube Interconnects for Radio Frequency Applications,eed for RF technologies that can operate at much higher frequencies, which can be potentially used for satellite or tetra-hertz imaging applications. Thus, there is a strong interest for novel materials, which can have more reliable and stable high-frequency performance. Flip?chip is one of the tech

懶惰人民

Fortify

Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components,ey enabler for next-generation multifunctional miniaturized systems. Traditional microscale materials do not lead to adequate enhancement in volumetric densities to miniaturize passive components as thin films or thin integrated passive devices. With these materials, component miniaturization also d