Titlebook: Nanopackaging; Nanotechnologies and James E. Morris Book 2018Latest edition Springer International Publishing AG, part of Springer Nature 2

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書目名稱Nanopackaging影響因子(影響力)




書目名稱Nanopackaging影響因子(影響力)學(xué)科排名




書目名稱Nanopackaging網(wǎng)絡(luò)公開度




書目名稱Nanopackaging網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Nanopackaging被引頻次




書目名稱Nanopackaging被引頻次學(xué)科排名




書目名稱Nanopackaging年度引用




書目名稱Nanopackaging年度引用學(xué)科排名




書目名稱Nanopackaging讀者反饋




書目名稱Nanopackaging讀者反饋學(xué)科排名

CRANK

Soft Mold Nanoimprint: Modeling and Simulation,een the nano-patterned mold and the polymer film substrate. It is suggested that a hydrophobic silane coating is necessary for reducing the adhesion force between the mold and the substrate leading to a successful printing result.

變態(tài)

Aids209

Limited

Nano-conductive Adhesives, ECAs in the 1950s [1–3]. Recently, ECA materials have been identified as one of the major alternatives for lead-containing solders for microelectronic packaging applications. There are two types of conductive adhesives: isotropically conductive adhesives (ICAs) and anisotropically conductive adhesives/films (ACAs/ACFs).

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Nuance

nationally recognized contributors, as well as updates in al.This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, a

粗俗人

Nanoparticle Fabrication,ions of physical and chemical processes are reviewed to understand recent progress in the industrial production for metal nanoparticles and related materials. This chapter also describes utilization of the nanomaterials for preparing electric wires, electrodes, and interconnects.

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