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Titlebook: Molecular Adhesion and Its Applications; The Sticky Universe Kevin Kendall Book 2001 Springer Science+Business Media New York 2001 Tenacit.

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書目名稱Molecular Adhesion and Its Applications
副標題The Sticky Universe
編輯Kevin Kendall
視頻videohttp://file.papertrans.cn/638/637976/637976.mp4
圖書封面Titlebook: Molecular Adhesion and Its Applications; The Sticky Universe Kevin Kendall Book 2001 Springer Science+Business Media New York 2001 Tenacit.
描述At the beginning of the twentieth century, engineers and technologists would have recognized the importance of adhesion in two main aspects: First, in the display of friction between surfaces — at the time a topic of growing importance to engineers; the second in crafts requiring the joining of materials — principally wood—to form engineering structures. While physical scientists would have admitted the adhesive properties of glues, gels, and certain pastes, they regarded them as materials of uncertain formulation, too impure to be amenable to precise experiment. Biological scientists were aware also of adhesive phenomena, but the science was supported by documentation rather than understanding. By the end of the century, adhesion and adhesives were playing a crucial and deliberate role in the formulation of materials, in the design and manufacture of engineering structures without weakening rivets or pins, and in the use of thin sections and intricate shapes. Miniaturization down to the micro- and now to the nano-level of mechanical, electrical, electronic, and optical devices relied heavily on the understanding and the technology of adhesion. For most of the century, physical sci
出版日期Book 2001
關(guān)鍵詞Tenacit; adhesion; colloid; dispersion; structure
版次1
doihttps://doi.org/10.1007/b100328
isbn_softcover978-1-4757-7492-4
isbn_ebook978-0-306-48406-3
copyrightSpringer Science+Business Media New York 2001
The information of publication is updating

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Book 2001 the display of friction between surfaces — at the time a topic of growing importance to engineers; the second in crafts requiring the joining of materials — principally wood—to form engineering structures. While physical scientists would have admitted the adhesive properties of glues, gels, and cer
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First, in the display of friction between surfaces — at the time a topic of growing importance to engineers; the second in crafts requiring the joining of materials — principally wood—to form engineering structures. While physical scientists would have admitted the adhesive properties of glues, gel
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Book 2001ning rivets or pins, and in the use of thin sections and intricate shapes. Miniaturization down to the micro- and now to the nano-level of mechanical, electrical, electronic, and optical devices relied heavily on the understanding and the technology of adhesion. For most of the century, physical sci
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