Titlebook: Microscale Heat Conduction in Integrated Circuits and Their Constituent Films; Y. Sungtaek Ju,Kenneth E. Goodson Book 1999 Springer Scienc

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書(shū)目名稱Microscale Heat Conduction in Integrated Circuits and Their Constituent Films影響因子(影響力)




書(shū)目名稱Microscale Heat Conduction in Integrated Circuits and Their Constituent Films影響因子(影響力)學(xué)科排名




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書(shū)目名稱Microscale Heat Conduction in Integrated Circuits and Their Constituent Films網(wǎng)絡(luò)公開(kāi)度學(xué)科排名




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書(shū)目名稱Microscale Heat Conduction in Integrated Circuits and Their Constituent Films讀者反饋學(xué)科排名

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1389-2134 Overview: 978-1-4613-7374-2978-1-4615-5211-6Series ISSN 1389-2134

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Review of Microscale Thermometry Techniques, these techniques are applicable for both device and material characterization while others are suitable only for device thermometry. This chapter reviews thermometry techniques for microdevices and microstructures. The techniques are categorized depending on whether they employ electrical or optical signals.

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Thermal Properties of Amorphous Dielectric Films,m the basis of the techniques that measure the in- and out-of-plane thermal conductivity thermal conductivity and volumetric heat capacity heat capacity of thin dielectric films. The characterization capability is applied to the study of process-dependent thermal properties of silicon dioxide, which serves as a model amorphous solid.

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Y. Sungtaek Ju Ph.D.,Kenneth E. Goodson Ph.D.lie?t damit Geld zu, das der Kapitalmarkt derzeit kaum bereitstellt, die anderen hoffen, durch die Unternehmenskooperation Innovationslücken schlie?en zu k?nnen. ..Markus Solf untersucht, ob das Modell "Finanzierung als Gegenleistung für zukünftige Forschungsergebnisse" eine Basis für langfristig er

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