| 書(shū)目名稱 | Microelectronic Materials and Processes | | 編輯 | R. A. Levy | | 視頻video | http://file.papertrans.cn/634/633203/633203.mp4 | | 叢書(shū)名稱 | NATO Science Series E: | | 圖書(shū)封面 |  | | 描述 | The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and | | 出版日期 | Book 1989 | | 關(guān)鍵詞 | Metall; X-Ray; alloy; crystal; semiconductors | | 版次 | 1 | | doi | https://doi.org/10.1007/978-94-009-0917-5 | | isbn_softcover | 978-0-7923-0154-7 | | isbn_ebook | 978-94-009-0917-5Series ISSN 0168-132X | | issn_series | 0168-132X | | copyright | Kluwer Academic Publishers 1989 |
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