Titlebook: Materials for Advanced Packaging; Daniel Lu,C.P. Wong Book 20091st edition Springer-Verlag US 2009 Compound.LED.Nanomaterial.development.e

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Advanced Bonding/Joining Techniques,onding process has extensive applications in silicon-glass bonding and glass-glass bonding. Diffusion bonding process forms chemical bonds by inter-diffusion of two different atoms over the bond line. Surface-activated bonding is valuable in bonding objects with large difference in coefficients of t

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