Titlebook: Materials for Advanced Packaging; Daniel Lu,C.P. Wong Book 2017Latest edition Springer International Publishing Switzerland 2017 Microelec

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Embedded Passives,s enabled by the transformation of today’s surface-mounted discrete passives such as resistors, capacitors, and inductors as thin films embedded in the package substrate or buildup layers. Such a trend would lead to miniaturized and more efficient power systems..This chapter reviews the fundamentals

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