Titlebook: Materials for Advanced Packaging; Daniel Lu,C.P. Wong Book 2017Latest edition Springer International Publishing Switzerland 2017 Microelec

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Advanced Bonding Technology Based on Nano- and Micro-metal Pastes, pastes have proven to be a feasible means of achieving high performance..A review of recent advances in the development of metal pastes for bonding technology is provided in this chapter. The basic bonding technology, fundamental concepts of metal pastes, and the fabrication processes of pastes are

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Flexible and Printed Electronics,o-roll compatible and printable processes are adopted. Gravure printing, offset printing, and flexography printing are commonly used contact printing technologies. Microcontact printing, nanoimprint, and transfer printing are emerging printing methods, which are of particular interest for the flexib

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Yu-Chou Shih,Gunwoo Kim Ph.D.,Jiun-Pyng You,Frank G. Shi Ph.D.mong the high-quality submissions, only 32 regular papers were accepted by the conferences. All of the selected conference papers are included in the conference978-3-540-88139-1978-3-540-88140-7Series ISSN 0302-9743 Series E-ISSN 1611-3349

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coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering..978-3-319-83209-8978-3-319-45098-8

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re being conducted in the context of the Rialto operating system — an object-based real-time kernel and programming environment currently being developed within Microsoft Research..A primary goal of this research is to develop appropriate real-time programming abstractions to allow multiple independ