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Titlebook: Maschinenarbeit und Ausnutzung der Naturkr?fte in Amerika; I. Kraft-, Licht-, W M. F. Gutermuth,E. Reichel,A. Riedler Book 1893 Springer-Ve

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樓主: JADE
41#
發(fā)表于 2025-3-28 16:34:25 | 只看該作者
M. F. Gutermuth,E. Reichel,A. Riedlerrcuit boards (PCBs) provide mechanical support and electrical interconnection for electronic devices. Many types of composite PCBs have been developed to meet various needs. Recent trends in reliability analysis of PCBs have involved developing of the structural integrity models for predicting lifet
42#
發(fā)表于 2025-3-28 19:01:10 | 只看該作者
43#
發(fā)表于 2025-3-28 23:33:37 | 只看該作者
44#
發(fā)表于 2025-3-29 05:13:14 | 只看該作者
A. Riedler the phrase “photorefractive effect” has been traditionally used for such effects in electro-optic materials, new materials, including photopolymers and photosensitive glasses, have been developed in recent years and are playing increasingly important roles in optical fiber communication systems. Ph
45#
發(fā)表于 2025-3-29 09:18:38 | 只看該作者
A. Riedlerlity of lead-free solder joints, and focused their attention on the formation of the intermetallic compound and its effect on the initiation and propagation of the fatigue cracks. An isothermal fatigue test method was used to improve the efficiency of fatigue study. Several lead-free solder alloys,
46#
發(fā)表于 2025-3-29 11:25:56 | 只看該作者
A. Riedlers have high current carrying capacity, excellent thermal conductivity, low thermal expansion coefficients, and are less susceptible to electromigration than conventional interconnect materials such as copper, tungsten and aluminum. It is likely that carbon nanotubes in combination with conventional
47#
發(fā)表于 2025-3-29 16:27:33 | 只看該作者
48#
發(fā)表于 2025-3-29 21:00:20 | 只看該作者
49#
發(fā)表于 2025-3-30 02:25:44 | 只看該作者
E. Reichelrcuit boards (PCBs) provide mechanical support and electrical interconnection for electronic devices. Many types of composite PCBs have been developed to meet various needs. Recent trends in reliability analysis of PCBs have involved developing of the structural integrity models for predicting lifet
50#
發(fā)表于 2025-3-30 05:26:58 | 只看該作者
E. Reichels have high current carrying capacity, excellent thermal conductivity, low thermal expansion coefficients, and are less susceptible to electromigration than conventional interconnect materials such as copper, tungsten and aluminum. It is likely that carbon nanotubes in combination with conventional
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