| 書目名稱 | Lock-in Thermography |
| 副標(biāo)題 | Basics and Use for E |
| 編輯 | Otwin Breitenstein,Martin Langenkamp |
| 視頻video | http://file.papertrans.cn/588/587827/587827.mp4 |
| 概述 | First book on lock-in thermography, an analytical method applied to the diagnosis of microelectronic devices.Includes supplementary material: |
| 叢書名稱 | Springer Series in Advanced Microelectronics |
| 圖書封面 |  |
| 描述 | Although the first publication on lock-in thermography appeared in 1988 con- cerning electronic device testing, this technique only became popular in the 1990s in connection with the nondestructive testing of materials (NDT, espe- cially photothermal and thermoelastic investigations). In the early 1990s our group at the Max Planck Institute of Microstructure Physics in Halle had the task to image small leakage currents in silicon solar cells. We soon realized that neither conventional (steady-state) thermography nor the only avail- able lock-in thermography system of that time was sensitive enough to image the tiny temperature differences caused by these leakage currents. Therefore we developed the "Dynamic Precision Contact Thermography" technique (DPCT), which was the first lock-in thermography system having a detection limit below 100 J. . LK. However, this system turned out to be too impractica- ble for general use, since it worked in a mechanical contacting mode, and its measurement time was necessarily many hours. With the availability of highly sensitive focal plane array thermocameras at the end of the 1990s, the way was opened to construct highly sensitive IR-based lock-in |
| 出版日期 | Book 20031st edition |
| 關(guān)鍵詞 | Experiment; Failure analysis; Lifetime mapping; Shunt imaging; Solar cell characterization; Trap density |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-3-662-08396-3 |
| isbn_ebook | 978-3-662-08396-3Series ISSN 1437-0387 Series E-ISSN 2197-6643 |
| issn_series | 1437-0387 |
| copyright | Springer-Verlag Berlin Heidelberg 2003 |
|Archiver|手機(jī)版|小黑屋|
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