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Titlebook: Lead-Free Electronic Solders; A Special Issue of t K. N. Subramanian Book 2007 Springer-Verlag US 2007 Hardware.development.electronics.lea

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發(fā)表于 2025-3-21 16:30:55 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書(shū)目名稱Lead-Free Electronic Solders
副標(biāo)題A Special Issue of t
編輯K. N. Subramanian
視頻videohttp://file.papertrans.cn/583/582217/582217.mp4
概述Contributions are from world wide research leaders.Comprehensive in scope.Each chapter focuses on a single issue and addresses the current understanding of the subject, the problems that still need to
圖書(shū)封面Titlebook: Lead-Free Electronic Solders; A Special Issue of t K. N. Subramanian Book 2007 Springer-Verlag US 2007 Hardware.development.electronics.lea
描述.In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However, till recently, solders used in electronics, remained lead-based. ..The worldwide multi-facetted research efforts to arrive at suitable solutions, especially as the deadline for implementation of lead-free electronic solders approaches, have resulted in an exhaustive number of research papers in several reviewed scientific journals. Similarly there have been presentations in several national and international meetings of various technical societies. It is impossible for any researcher or student to be aware of all the materials that have been, and are being, published in these many different sources, so it becomes essential to have most of the relevant and currently available information presented in a single publication. With this goal in mind the important issues encountered in the lead-free electronic solder area were identified, and researchers recognized for their significant scientific contributions in those areas were invited to write artic
出版日期Book 2007
關(guān)鍵詞Hardware; development; electronics; lead-free solders; mechanical engineering; metal; microelectronics pac
版次1
doihttps://doi.org/10.1007/978-0-387-48433-4
isbn_softcover978-1-4419-4302-6
isbn_ebook978-0-387-48433-4
copyrightSpringer-Verlag US 2007
The information of publication is updating

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發(fā)表于 2025-3-21 22:56:27 | 只看該作者
Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints underssing same geometry and prepared under the same conditions, indicate the important contributions of each of the service and material parameters, and the solder alloy composition, for reliability considerations.
板凳
發(fā)表于 2025-3-22 01:58:15 | 只看該作者
nderstanding of the subject, the problems that still need to.In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However,
地板
發(fā)表于 2025-3-22 06:28:48 | 只看該作者
Sn-Zn low temperature solder,enables one to manufacture sound electronic products without any serious problems. The basic properties and the current understandings on the limit of the application of this solder are reviewed in this paper.
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Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys,orphology on shear behavior of solder joints, and (d) prediction of crack growth in solder joints. In all these cases, the experimentally observed behavior matches very well with the microstructure-based models.
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H. Ipser,H. Flandorfer,Ch. Luef,C. Schmetterer,U. Saeedxtbooks. Many conference proceedings on the subject have been produced that give excellent detail on research topics. However, the subject matter is rarely presented as a composite whole. New technology has broadened the scope of methods available for studying body temperature. Thermography in parti
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發(fā)表于 2025-3-23 04:32:27 | 只看該作者
Sinn-Wen Chen,Chao-Hong Wang,Shih-Kang Lin,Chen-Nan Chiuany conference proceedings on the subject have been produced that give excellent detail on research topics. However, the subject matter is rarely presented as a composite whole. New technology has broadened the scope of methods available for studying body temperature. Thermography in particular has
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