Titlebook: Into The Nano Era; Moore‘s Law Beyond P Howard R. Huff Book 2009 Springer-Verlag Berlin Heidelberg 2009 CMOS.Counter.Defects.MOSFET devices

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Surface and Interface Chemistry for Gate Stacks on Siliconures, until recently remained the gate insulator of choice. Its success has been based on the wonderful properties of the silicon/silicon dioxide interface. This interface has only about 10. cm. electrically active defects. And after a simple passivating hydrogen exposure, 10. cm. defects remain—only one defect for every 100,000 interface atoms!

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Book 2009he past five decades of this era, it is proposed that a firmer foundation can be laid for the research that will ensue and possibly provide a glimpse of what is next to come in the nanotechnology era..

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The Economic Implications of Moore’s Law industry crossed it just after the second millennium had finished. In less than 50 years, it had come from transistors made in mils (one-thousandth of an inch or 25.4 microns); to integrated circuits which were popularized as microchips; and then as the third millennium dawned, nanochips. At this w

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Using Silicon to Understand Siliconnot always been that way. There was a time before silicon. In the 1940s, transistors did not exist at all and in the early 1950s, transistors were made of germanium, not silicon. These germanium transistors were not very reliable; in particular they were difficult to package and process, and worked

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Structural, Elemental, and Chemical Complex Defects in Silicon and Their Impact on Silicon Devicesct-free silicon would be a highly resistive material that would not find many practical applications before adding impurities to dope it n-type or p-type. In practice, besides intentionally introduced impurities (dopants), silicon always contains native defects (self-interstitials and vacancies) and

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Surface and Interface Chemistry for Gate Stacks on Silicon four decades, we have witnessed an exponential increase in the integration density of logic circuits (“Moore’s law” [.]), powered by exponential reductions in MOSFET device size. Despite these changes, silicon oxide, usually grown by simple exposure to oxygen gas or water vapor at elevated temperat

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