Titlebook: Interfaces in High-Tc Superconducting Systems; Subhash L. Shindé,David A. Rudman Book 1994 Springer Science+Business Media New York 1994 J

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Microstructure of Interfaces in YBa,Cu,O, Thin Films,ly and routinely produced by a variety of in situ deposition techniques [1–12]. In particular, the techniques of laser ablation [1, 2] and off-axis sputter deposition [4, 6], both using a single, composite target, have emerged as the most reliable in situ physical processes producing uniform, high-q

extemporaneous

VERT

Initiative

指派

Overlayer Formation on High-Temperature Superconductors,s in HTS science and technology. The relevance of such surface/interface properties is clear: If these superconductors are to be integrated with other materials, then materials compatibility issues must be thoroughly explored and, ultimately, optimized. In the last few years, the techniques of surfa

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by the brittleness, which is controlled by flaws in the polycrystalline structure acting as crack nuclei. At high temperatures, the materials creep. The creep rates are governed partly by the properties of the grain boundaries and partly by the plastic properties of the crystal grains, the latter of

CANT

喃喃而言

Ian D. Raistrick,Marilyn Hawley substrates. Although p97/Cdc48p is not dedicated exclusively to ERAD, its ability to physically associate with ERAD substrates, with VIMP and with the E3 gp78 suggest that the p97/Cdc48. complex acts as a coordinator that maintains coupling between the different steps in ERAD.

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