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Titlebook: Integrated Circuit Defect-Sensitivity: Theory and Computational Models; José Pineda Gyvez Book 1993 Springer Science+Business Media New Yo

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發(fā)表于 2025-3-21 20:01:10 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書(shū)目名稱Integrated Circuit Defect-Sensitivity: Theory and Computational Models
編輯José Pineda Gyvez
視頻videohttp://file.papertrans.cn/469/468443/468443.mp4
叢書(shū)名稱The Springer International Series in Engineering and Computer Science
圖書(shū)封面Titlebook: Integrated Circuit Defect-Sensitivity: Theory and Computational Models;  José Pineda Gyvez Book 1993 Springer Science+Business Media New Yo
描述The history of this book begins way back in 1982. At that time a research proposal was filed with the Dutch Foundation for Fundamental Research on Matter concerning research to model defects in the layer structure of integrated circuits. It was projected that the results may be useful for yield estimates, fault statistics and for the design of fault tolerant structures. The reviewers were not in favor of this proposal and it disappeared in the drawers. Shortly afterwards some microelectronics industries realized that their survival may depend on a better integration between technology-and design-laboratories. For years the "silicon foundry" concept had suggested a fairly rigorous separation between the two areas. The expectation was that many small design companies would share the investment into the extremely costful Silicon fabrication plants while designing large lots of application-specific integrated circuits (ASIC‘s). Those fabrication plants would be concentrated with only a few market leaders.
出版日期Book 1993
關(guān)鍵詞circuit; design; electronics; integrated circuit; microelectronics; model; modeling
版次1
doihttps://doi.org/10.1007/978-1-4615-3158-6
isbn_softcover978-1-4613-6383-5
isbn_ebook978-1-4615-3158-6Series ISSN 0893-3405
issn_series 0893-3405
copyrightSpringer Science+Business Media New York 1993
The information of publication is updating

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Defect Semantics and Yield Modeling,luding the necessary relationship between process induced defects and faults[24,42,74,94].The second main topic is an objective discussion on yield modeling, it’s difficulties and development through the last 30 years.
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Introduction,it area (defect density). By understanding the effect of defects in IC designs, it is possible to devise yield tolerant methodologies, e.g. module allocation with “balanced defect sensitivities”, “defect tolerant” driven techniques for placement and routing, etc.
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Single Defect Multiple Layer (SDML) Model, either a short or a break. Yet if the defect falls in the poly-diffusion area of a transistor it can be fatal even if it does not totally break the geometrical pattern. It is thus not sufficient to extract single-layer critical areas if either an accurate yield prediction or a realistic layout to fault extraction are desired.
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IC Yield Prediction and Single Layer Critical Areas,s implementing the same function. The layout styles are Standard Cells (STD), Programmable Logic Array (PLA), and Transistor Gate Matrix (TM), see Fig. 7.1. The technology is CMOS of 2μm of minimum resolution features.
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The Springer International Series in Engineering and Computer Sciencehttp://image.papertrans.cn/i/image/468443.jpg
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