Titlebook: Informatik für Ingenieure und Naturwissenschaftler 1; Grundlagen, Programm Gerd Küveler,Dietrich Schwoch Textbook 2009Latest edition Vieweg

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esented, and gold, nickel and palladium surface finishes are discussed. ?The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components..In summary, this book:.Introduces copper wir

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Gerd Küveler,Dietrich Schwochesented, and gold, nickel and palladium surface finishes are discussed. ?The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components..In summary, this book:.Introduces copper wir

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Gerd Küveler,Dietrich Schwochcusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components..In summary, this book:.Introduces copper wir978-1-4939-5349-3978-1-4614-5761-9