Titlebook: High-Frequency Characterization of Electronic Packaging; Luc Martens Book 1998 Springer Science+Business Media New York 1998 algorithms.ci

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Book 1998 a comprehensive guide for the start of research and tohelp in performing high-frequency measurements. Important notions inhigh- frequency characterization such as S-parameters, calibration,probing, de-embedding and measurement-based modeling are explained.The described techniques are illustrated wi

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High-Frequency Characterization of Electronic Packaging

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1389-2169 haracterization such as S-parameters, calibration,probing, de-embedding and measurement-based modeling are explained.The described techniques are illustrated wi978-1-4613-7573-9978-1-4615-5623-7Series ISSN 1389-2169

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High-Frequency Measurement Techniques for Electronic Packaging, (a), a cross-section of a circular coaxial connector or cable is shown. It essentially consists of two concentric conductors of which one is the signal conductor and the other one the reference or ground conductor.

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1389-2169 ing. Understanding high-frequency behavior ofpackaging is of growing importance due to higher clock-speeds incomputers and higher data transmission rates in broadbandtelecommunication systems. Basic knowledge of the high-frequencybehavior of packaging and interconnects is, therefore, indispensablefo

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Electronic Packaging and High Frequencies,and leads, balls or studs. Besides their electrical properties, IC-packages also provide a protection of the integrated circuit to the environment. We will give examples of the various electronic packaging in all chapters of this book.

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High-Frequency Measurement Techniques,al IC-design. However, it will be shown that frequency- and time-domain analyzers deliver compatible and complimentary results. The instruments, described in this chapter, are able to measure the black-box description or signal integrity characteristics of a package or interconnection under test (cf. chapter 2).

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Electrical Description of Electronic Packaging,e package under test. Once this description is chosen, the parameters to derive the description must be determined. The electrical properties of packages can be described in two ways: by qualitative characteristics or by quantitative models.