Titlebook: High Thermal Conductivity Materials; Subhash L. Shindé,Jitendra S. Goela Book 2006 Springer-Verlag New York 2006 boron.carbon.carbon nanot

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Chemical-Vapor-Deposited Diamond for High-Heat-Transfer Applications,

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Thermal Characterization of the High-Thermal-Conductivity Dielectrics,ers of magnitude. As a result of these complications, a wide range of experimental techniques have been developed over the years, which may or may not be appropriate for thermal characterization of high-thermal-conductivity material of given microstructure and physical dimension. We will describe an

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Fabrication of High-Thermal-Conductivity Polycrystalline Aluminum Nitride: Thermodynamic and Kinetis—effectively scavenging Al.O. and purifying the lattice. The thermodynamic considerations relate to the affinity between Al.O. and the additive to form aluminates, which can be described in terms of the standard free energy of formation, Δ.., of the respective aluminate. The greater the |Δ..|, with

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Donald T. Morelli,Glen A. Slackit also encompasses the efficient on-chip exchange of parameter values and task results between parent and child accelerator tasks. Our solution is able to handle recursive task structures and is shown to have latency reductions of over 35x compared to the prior approaches.

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Yizhang Yang,Sadegh M. Sadeghipour,Wenjun Liu,Mehdi Asheghi,Maxat TouzelbaevSoftware Defined Networking (SDN) architectural concepts by decomposing each ingress frame in two streams: a data frame moving across the data plane and an instruction frame provided with all the necessary metadata that –in parallel and synchronously to the data frame– evolves through the different

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Danièle Fournieron shorter or longer hop paths. An adaptive congestion avoidance feature is integrated. Without congestion awareness, the proposed algorithm which utilizes multiple layers has upto 38% decrease in latency and with congestion awareness has upto 56% decrease in latency compared to the popular XY routi