Titlebook: Handbook of Neuroengineering; Nitish V. Thakor Reference work 2023 Springer Nature Singapore Pte Ltd. 2023 Brain structure and function.Vi

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Flexible and Soft Materials and Devices for Neural Interfacemensional properties of materials with the aim to match the mechanical, chemical, and electrical properties of the nervous system. We will discuss these strategies applied to different components of an implanted device from insulation substrate and conductive electrode materials to soft tethers and

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Quantitative Assessment of the Mechanical Properties of the Neural Interface chapter, we attempt to summarize what we know about the mechanical properties of the brain tissue-implant interface from our studies over the last several years and from a diversity of imaging, neurophysiology, and neural engineering studies. We also propose an improvised, penetrating “microindenta

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Distributed Neural Interfaces: Challenges and Trends in Scaling Implantable Technologyhis architecture brings a new set of challenges ranging from the optimization of ultra-low-power electronics, through the formulation of a wireless transmission scheme for efficient power delivery and data transfer to the investigation of novel materials and methods for the fabrication of micro-scal

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Challenges for Large-Scale Brain-Machine Interfacesunication link facilitating low-latency forward transmission for decoding by external computing platforms. This must of course occur in concert with the reverse processes, whereby the same implanted probes would provide a means to “write-in” feedback information into the brain through injection of e

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: Intraneural and Extraneural Flexible Sensor Architectures for Neural Probing traces and sensing sites) that have enabled such flexible designs. We provide brief descriptions of the design innovations in the intraneural and extraneural flexible electrode interfaces for the neural tissues such as the brain and the peripheral nerve. The chapter concludes with a road map of the