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Titlebook: Handbook Of Electronics Packaging Design and Engineering; Bernard S. Matisoff Book 1982 Van Nostrand Reinhold Company Inc. 1982 control.de

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樓主: Corrugate
11#
發(fā)表于 2025-3-23 11:12:28 | 只看該作者
Project Planning,es to be met at specific dates and then make every effort to meet them. Unforeseen problems sometimes cause setbacks in the original plan; at such times, the engineer should simply replot the original plan, noting the cause for delay, and then proceed. The history recorded during the task will be useful in estimating future tasks.
12#
發(fā)表于 2025-3-23 15:06:45 | 只看該作者
Subassemblies and Assemblies,le to sectionalize or modularize subassemblies into a series of replaceable units, with the parts and wiring arranged to provide for maximum accessibility (Figure 8-1). Each unit should contain all of the components required to perform a specific function, such as amplifying, rectifying, frequency controlling, etc. (Figures 8-2 and 8-3).
13#
發(fā)表于 2025-3-23 21:31:35 | 只看該作者
14#
發(fā)表于 2025-3-24 01:27:55 | 只看該作者
Radio Frequency and Electromagnetic Shielding, device were possible, it would be impractical. However, there are many techniques that can be used to prevent unwanted radiation from degrading performance or causing a malfunction. This chapter provides concise information on techniques for controlling and suppressing electromagnetic radiation.
15#
發(fā)表于 2025-3-24 06:18:38 | 只看該作者
Materials and Processes, and applicable finishes. They present the common engineering materials and their recommended applications. Also, the applicable finishes are presented with their recommended use and their compatibility with various base materials.
16#
發(fā)表于 2025-3-24 08:24:05 | 只看該作者
17#
發(fā)表于 2025-3-24 14:05:57 | 只看該作者
https://doi.org/10.1007/978-3-642-17952-5The electronics packaging design and engineering fields perform tasks of ever-increasing importance in the electronics industry. They can be either the strength or the weakness of electronics systems engineering. Much depends on how its purpose and functions are interpreted within the engineering organization.
18#
發(fā)表于 2025-3-24 17:53:35 | 只看該作者
https://doi.org/10.1007/978-3-031-30142-1The human engineering design guidelines presented in this chapter are directed toward hardware problems involving man-machine interfaces. When the engineer or designer cannot find an adequate solution herein, a human factors specialist should be consulted.
19#
發(fā)表于 2025-3-24 20:04:01 | 只看該作者
https://doi.org/10.1007/978-3-030-56001-0Reliability is one of the prime requirements in the design of electronics equipment. Reliability is the ability of a product to perform as designed for the specified life of the equipment.
20#
發(fā)表于 2025-3-25 01:28:12 | 只看該作者
https://doi.org/10.1057/978-1-349-95053-9The field of high temperature control in Electronic Assemblies is, of course, too broad to be completely covered in this text. Nevertheless, this chapter is intended to establish a basic approach to a thermal study for any unit under consideration, and to obviate the minor problems often encountered in a thermal design.
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