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Titlebook: Handbook Of Electronics Packaging Design and Engineering; Bernard S. Matisoff Book 1990 Van Nostrand Reinhold 1990 electronics.manufacturi

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書目名稱Handbook Of Electronics Packaging Design and Engineering
編輯Bernard S. Matisoff
視頻videohttp://file.papertrans.cn/421/420728/420728.mp4
圖書封面Titlebook: Handbook Of Electronics Packaging Design and Engineering; Bernard S. Matisoff Book 1990 Van Nostrand Reinhold 1990 electronics.manufacturi
描述The Handbook of Electronics Packaging Design and Engineering has been writ- ten as a reference source for use in the packaging design of electronics equip- ment. It is designed to provide a single convenient source for the solution of re- curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: ? Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. ? Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. ? Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting p
出版日期Book 1990
關(guān)鍵詞electronics; manufacturing; mechanics; metals; packaging
版次1
doihttps://doi.org/10.1007/978-94-011-7047-5
isbn_softcover978-94-011-7049-9
isbn_ebook978-94-011-7047-5
copyrightVan Nostrand Reinhold 1990
The information of publication is updating

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Justus Akinsanya,Greg Cox,Lucy Fletchertary has set up certain minimum standards that can also be effectively used in commercial products. The design standards presented herein attempt to achieve the combined minimum requirements of all of the military and commercial standards in use today (Table 16-1).
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Daniel Callahan,H. Tristram Engelhardt costs. This chapter provides some of the basic manufacturing procedures available and the restrictions that must be considered in designing modern electronics equipment that will be manufacturable and salable at competitive prices.
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The Roper, Logan and Tierney Model in Actionth the composition of the solution, current density, agitation, and solution temperature. Hardness, conductivity, solderability, and corrosion-resistance are generally the most important plating properties, since coating-life is usually dependent upon these factors.
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The Rosetta Stone of the Human Mindrd module should be capable of installation into any existing standard installation, such as a standard 19-inch EIA (Electronics Industries Association) rack and panel, ATR (air transport racking) cases (Figure 12-2), or commercial instrument cases.
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