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Titlebook: Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Appro; Farhang Yazdani Book 2018 Springer I

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書目名稱Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Appro
編輯Farhang Yazdani
視頻videohttp://file.papertrans.cn/347/346985/346985.mp4
概述Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products.Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex,
圖書封面Titlebook: Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Appro;  Farhang Yazdani Book 2018 Springer I
描述.This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design.? Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively.? Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level..
出版日期Book 2018
關(guān)鍵詞2; 5D/3D Design; 2; 5D/3D Integration; 2; 5D/3D Memory & Logic Integration; 3D Integrated Circuits; 3D Memo
版次1
doihttps://doi.org/10.1007/978-3-319-75769-8
isbn_softcover978-3-030-09323-5
isbn_ebook978-3-319-75769-8
copyrightSpringer International Publishing AG, part of Springer Nature 2018
The information of publication is updating

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