| 書目名稱 | Fluid Flow, Heat Transfer and Boiling in Micro-Channels | | 編輯 | L.P. Yarin,A. Mosyak,G. Hetsroni | | 視頻video | http://file.papertrans.cn/345/344591/344591.mp4 | | 概述 | Micro-channels are the future for cooling all types of circuits.Thermodynamics is the key factor for designing effective coolers.Includes supplementary material: | | 叢書名稱 | Heat and Mass Transfer | | 圖書封面 |  | | 描述 | The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects o | | 出版日期 | Book 2009 | | 關鍵詞 | Caoilary flow; Cooling; Dissipation; MEMS; evaporating meniscus; fluid mechanics; stability; fluid- and aer | | 版次 | 1 | | doi | https://doi.org/10.1007/978-3-540-78755-6 | | isbn_softcover | 978-3-642-09754-6 | | isbn_ebook | 978-3-540-78755-6Series ISSN 1860-4846 Series E-ISSN 1860-4854 | | issn_series | 1860-4846 | | copyright | Springer-Verlag Berlin Heidelberg 2009 |
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