| 書目名稱 | Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System |
| 編輯 | Seiji Samukawa |
| 視頻video | http://file.papertrans.cn/342/341563/341563.mp4 |
| 概述 | Is the first book that focuses on an etching profile prediction system from a practical application viewpoint.Explains the development of an effective on-wafer UV sensor, on-wafer charge-up sensor and |
| 叢書名稱 | SpringerBriefs in Applied Sciences and Technology |
| 圖書封面 |  |
| 描述 | .This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of real etching profiles based on monitoring data. Readers are made familiar with these sensors, which can measure real plasma process surface conditions such as defect generations due to UV-irradiation, ion flight direction due to charge-up voltage in high-aspect ratio structures and ion sheath conditions at the plasma/surface interface. The plasma etching profile realistically predicted by a computer simulation based on output data from these sensors is described.. |
| 出版日期 | Book 2014 |
| 關鍵詞 | Etching Profile; On-wafer Monitoring Technique; On-wafer UV Sensor; Ultralarge-scale integrated circuit |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-4-431-54795-2 |
| isbn_softcover | 978-4-431-54794-5 |
| isbn_ebook | 978-4-431-54795-2Series ISSN 2191-530X Series E-ISSN 2191-5318 |
| issn_series | 2191-530X |
| copyright | The Author(s) 2014 |
|Archiver|手機版|小黑屋|
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