| 書(shū)目名稱(chēng) | Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys? |
| 編輯 | Erdogan Madenci,Ibrahim Guven,Bahattin Kilic |
| 視頻video | http://file.papertrans.cn/342/341418/341418.mp4 |
| 叢書(shū)名稱(chēng) | The Springer International Series in Engineering and Computer Science |
| 圖書(shū)封面 |  |
| 描述 | .Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS?. describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS? that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS? to perform solder joint reliability analysis. .Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS?. allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages. |
| 出版日期 | Book 2003 |
| 關(guān)鍵詞 | fatigue; finite element method; modeling; software; tables |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-1-4615-0255-5 |
| isbn_softcover | 978-1-4613-4989-1 |
| isbn_ebook | 978-1-4615-0255-5Series ISSN 0893-3405 |
| issn_series | 0893-3405 |
| copyright | Springer Science+Business Media New York 2003 |
|Archiver|手機(jī)版|小黑屋|
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