Titlebook: Electronics Packaging Forum; Volume Two James E. Morris Book 1991 Van Nostrand Reinhold 1991 circuit.development.electrical overstress (EOS

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Diamond Thin Films: Applications in Electronics Packaging,terial known to humanity, diamond scores high on almost all the categories of engineering properties such as thermal conductivity, electrical resistivity, and dielectric constant as summarized in Table 7.1. The combination of these outstanding properties makes diamond very attractive as the engineering material of tomorrow.

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