Titlebook: Electronic Equipment Packaging Technology; Gerald L. Ginsberg Book 1992 Springer Science+Business Media New York 1992 assembly.base.develo

別炫耀

Definitive

https://doi.org/10.1007/978-88-470-1986-7 transport heat from individual components in a controlled manner to the ultimate system heat sink, Figure 9.1. In general, it is not usually too difficult to package the equipment in such a manner that it can operate properly at a nominal end-use thermal enviroment. The challenge arises in attempti

Ptosis

https://doi.org/10.1007/978-88-470-0779-6 to low-volume/high-cost space-age technology. Therefore, as can be expected, each end product configuration and packaging implementation is unique to the application. However, although the results vary considerably, the underlying considerations to be taken into account generally fall into several

刺耳

Parameter

Fibrillation

外來(lái)

End Product Applications,owing information is intended to provide examples of some of the general concerns that are associated with the packaging of several different categories of equipment. However, it is important to keep in mind that considerations discussed for one category of electronic product can often be appropriate for one or more of the others.

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聽寫

sinoatrial-node

Electronic Equipment Enclosures,ted, by taking advantage of the expertise of the enclosure manufacturer. These firms offer products ranging from the outside enclosure to complete packaging systems that permit the customer to simply plug in printed board assemblies to create the basic product.