Titlebook: Electrical Design of Through Silicon Via; Manho Lee,Jun So Pak,Joungho Kim Book 2014 Springer Science+Business Media Dordrecht 2014 3-Dime

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Manho Lee,Jun So Pak,Joungho KimProvides fundamental modeling of TSV which is a very essential part of 3D ICs.Includes both numerical formula analysis and qualitative explanations.Approach from various view points: signal integrity,

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Grundriss der psychiatrischen Diagnostiklicon via (TSV) noise coupling and S. of TSV channel were measured in both frequency and time domain from corresponding TSV based test vehicle. These measurement results are analyzed using the temperature-dependent TSV lumped model to TSV channel and shows good correlation with measurement. Under th

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