| 書目名稱 | Electrical Conductive Adhesives with Nanotechnologies | | 編輯 | Yi Li,Daniel Lu,C. P. Wong | | 視頻video | http://file.papertrans.cn/306/305707/305707.mp4 | | 概述 | Compares and contrasts lead-free soldering techniques and electrically conductive adhesives and discusses the advantages of electrically conductive adhesives.Discusses isotropically conductive adhesiv | | 圖書封面 |  | | 描述 | .“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.. | | 出版日期 | Book 2010 | | 關(guān)鍵詞 | electrical conductive adhesives; electronic devices; electronic packaging; integrated circuit; lead-free | | 版次 | 1 | | doi | https://doi.org/10.1007/978-0-387-88783-8 | | isbn_softcover | 978-1-4899-8307-7 | | isbn_ebook | 978-0-387-88783-8 | | copyright | Springer-Verlag US 2010 |
The information of publication is updating
|
|