Titlebook: ESD Design and Analysis Handbook; James E. Vinson,Joseph C. Bernier,Juin J. Liou Book 2003 Springer Science+Business Media New York 2003 e

可互換

RADE

神圣將軍

推崇

Chip Level Protection,voltage produced by the conduction path below the voltage that causes damage. Conducting the current and clamping the voltage are the key points to providing ESD protection. The goal is to minimize the current density and electric field in a device during the ESD event [4–1].

尊嚴(yán)

nettle

環(huán)形

Failure Analysis Techniques,ent. Without failure analysis it is impossible to determine the cause of failure and implement corrective actions to prevent its reoccurrence. ESD related failures come from two primary sources. The first are failures produced by the ESD testers as a result of product classification. Part of a new p

GRIPE

Environmental Protection,nmental Protection implements procedures and uses extra equipment whose purpose is to limit charge build up and control the discharge path. This form of protection is one of two essential means of providing an overall ESD protection strategy. The other technique is increasing circuit robustness and

管理員

Seizure