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Titlebook: Dynamics of Microelectromechanical Systems; Nicolae Lobontiu Textbook 2007 Springer-Verlag US 2007 Dynamics.Electrical.Lobontiu.MEMS.Micro

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書(shū)目名稱(chēng)Dynamics of Microelectromechanical Systems
編輯Nicolae Lobontiu
視頻videohttp://file.papertrans.cn/285/284127/284127.mp4
概述Focuses on the mechanical domain (specifically, the quasi-static sub-domain), which is at the core of most of the MEMS.Provides a more in-depth look at the main problems that involve reliable modeling
叢書(shū)名稱(chēng)Microsystems
圖書(shū)封面Titlebook: Dynamics of Microelectromechanical Systems; Nicolae Lobontiu Textbook 2007 Springer-Verlag US 2007 Dynamics.Electrical.Lobontiu.MEMS.Micro
描述.Dynamics of Microelectromechanical Systems. is?a systematic overview of the dynamics of MEMS (microelectromechanical systems), microstructures, and their responses. The focus is on the mecahnical/structural micro domain and the compliant nature of mechanical transmission...Features of this work include:....An in-depth treatment of problems that involve reliable modeling, analysis and design,....Analytical models with correct dependences on service dimensions,....Cantilever based systems for nanofabrication researchers and designers, and....Dynamics of complex spring and beam microsystems...This material contains numerous fully-solved examples as well as many end-of-the-chapter problems. This is a follow up to the book,. Mechanics of Microelectromechanical Systems,. by Lobontiu and Garcia (Springer 2004), but the material in this new book is self-contained.? An instructor‘s solution manual is available on the book‘s webpage at springer.com....Dynamics of Microelectromechanical Systems. is a timely text and reference for microstructural engineers, microengineers, and MEMS specialists..
出版日期Textbook 2007
關(guān)鍵詞Dynamics; Electrical; Lobontiu; MEMS; Micro; Nano; Vibrations; design; frequency-domain analysis; impedance; m
版次1
doihttps://doi.org/10.1007/978-0-387-68195-5
isbn_softcover978-1-4419-4225-8
isbn_ebook978-0-387-68195-5Series ISSN 1389-2134
issn_series 1389-2134
copyrightSpringer-Verlag US 2007
The information of publication is updating

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Energy Losses in MEMS and Equivalent Viscous Damping, result of the interaction between external and internal mechanisms. Fluid- structure interaction (manifested as squeeze- or slide-film damping), anchor (connection to substrate) losses, thermoelastic damping (TED), surface/volume losses and phonon-mediated damping are the most common energy loss me
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God Save the King: , in Wonder-land result of the interaction between external and internal mechanisms. Fluid- structure interaction (manifested as squeeze- or slide-film damping), anchor (connection to substrate) losses, thermoelastic damping (TED), surface/volume losses and phonon-mediated damping are the most common energy loss me
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God Save the King: , in Wonder-lande motions to be coupled. Lagrange’s equations are used to model the free response of multiple DOF micromechanical systems. Several example problems of massspring microsystems undergoing linear or/and rotary resonant vibrations are amply discussed and fully solved.
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Microcantilevers and Microbridges: Bending and Torsion Resonant Frequencies,-parameter modeling, which permits separate calculation of equivalent stiffness and inertia properties en route of obtaining the above-mentioned resonant frequencies, is also used in this chapter for certain configurations.
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