Titlebook: Diffusion Processes in Advanced Technological Materials; Devendra Gupta (Emeritus Research Staff Member) Book 2005 Springer-Verlag Berlin

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ontains an entire chapter devoted to computer simulations ofMy 12-year-old granddaughter Nina Alesi once asked me, "Grandpa, you are a scientist at IBM, so what do you do?" I tried to reply, "Oh, I watch atoms move. . . " But before I could finish this sentence, my 7-year-old grandson Vinnie interje

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References no. 18421–21504 / ABD — ZYLprocesses involving higher temperatures than those used for the deposition. This chapter discusses techniques for measuring stresses in thin metal films attached to substrates and their relaxation by plastic deformation and diffusional creep.

Debrief

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Reactive Phase Formation: Some Theory and Applications,ereof with Sn during soldering. Such phenomena are not only important in electronic technology; they are encountered in an endless variety of conditions, as in the high-temperature reactions between finely divided oxide particles to form cements. Limoge and Boquet[.] provide excellent general information about such phenomena.

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References no. 15368–18420 / ABD-ZUT polymer glass transition, which can be depressed at the surface[., .] metal clusters are generally embedded in the polymer and, depending on their size and the polymer viscosity, may perform a Brownian motion.[., .]

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Diffusion in Bulk Solids and Thin Films: Some Phenomenological Examples,e volumes. The mixing rate depends on the concentration difference and is inversely proportional to the square root of the density of the gas. Furthermore, he established that “.,” and that the diffusion rates in liquids are much slower than in gases. These concepts later became the bases for mathematical treatment of the diffusion process.