Titlebook: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs; Brandon Noia,Krishnendu Chakrabarty Book 2014 Springer Inte

歡呼

Fluid Mechanics and Its ApplicationsAs discussed in previous chapters, 3D ICs require both pre-bond and post-bond testing to ensure stack yield. The goal of pre-bond testing is to ensure that only known good die (KGD) are bonded together to form a stack. Post-bond test ensures the functionality of the complete stack and screens for defects introduced in alignment and bonding.

追蹤

Built-In Self-Test for TSVs,Pre-bond testing of individual dies prior to stacking is crucial for yield assurance in 3D-SICs [42, 43]. A complete known-good-die (KGD) test requires testing of die logic, power and clock networks, and the TSVs that will interconnect dies after bonding in the stack.

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Overcoming the Timing Overhead of Test Architectures on Inter-Die Critical Paths,As discussed in previous chapters, 3D ICs require both pre-bond and post-bond testing to ensure stack yield. The goal of pre-bond testing is to ensure that only known good die (KGD) are bonded together to form a stack. Post-bond test ensures the functionality of the complete stack and screens for defects introduced in alignment and bonding.

oxidant

https://doi.org/10.1007/978-3-030-93578-8ters 3 and 4 presented methods through BIST and probing to enable pre-bond TSV test. While TSV test is important for KGD test, it covers only a small fraction of the tests that must be performed to achieve complete KGD test. In particular, the majority of die area is dedicated to logic and associated memory.

音樂(lè)戲劇

Pre-bond Scan Test Through TSV Probing,ters 3 and 4 presented methods through BIST and probing to enable pre-bond TSV test. While TSV test is important for KGD test, it covers only a small fraction of the tests that must be performed to achieve complete KGD test. In particular, the majority of die area is dedicated to logic and associated memory.

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key test and design-for-test technologies, emerging standardThis book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing

Mosaic

極大痛苦

Essential

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