Titlebook: Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics; Sunil P. Khatri,Robert K. Brayton,Alberto L. Sangi Book 2001 Springer Sc

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Validating Deep Sub-Micron Effects,n 4. Finally, in Sections 5, we experimentally validate the delay variation (Section 5.1) and signal integrity (Section 5.2) problems by means of SPICE [Nagel, 1995] simulations. In Section 6, we review some existing techniques to handle cross-talk.

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shrink, a host of electrical problems like cross-talk, electromigration, self-heat, etc. are becoming important. Cross-talk is one of the major problems since it results in unpredictable design behavior. In particular, it can result in significant delay variation or signal integrity problems in a wi

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