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Titlebook: Contemporary Trends in Semiconductor Devices; Theory, Experiment a Rupam Goswami,Rajesh Saha Book 2022 The Editor(s) (if applicable) and Th

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41#
發(fā)表于 2025-3-28 15:37:21 | 只看該作者
42#
發(fā)表于 2025-3-28 22:32:01 | 只看該作者
Theory of Nanostructured Kesterite Solar Celltraps as centres for recombination. The performance metrics of the solar cell are well explored and analysed with different types of recombination centres. Finally, the current–voltage characteristics and efficiency of the solar cell are demonstrated, which may give a clear visualization of low-cost next generation thin film solar cells.
43#
發(fā)表于 2025-3-29 01:00:05 | 只看該作者
Nano-Material Based Sensitized Solar Cellsical details, focusing more on the technology’s practical aspects. The modern techniques adapted by researchers to further enhance solar cells’ efficient working, utilizing nanotechnology, have been discussed in the chapter. The technological limitations faced by photovoltaic researchers have also been discussed.
44#
發(fā)表于 2025-3-29 06:54:38 | 只看該作者
45#
發(fā)表于 2025-3-29 11:07:13 | 只看該作者
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發(fā)表于 2025-3-29 12:52:47 | 只看該作者
47#
發(fā)表于 2025-3-29 16:33:34 | 只看該作者
Introduction,ems. From metal oxide semiconductor field effect transistors (MOSFETs), and FinFETs to interconnects and solar cells, this book picks up some of the thrust areas in the light of its title and arranges them for better readability by researchers and individuals interested in the domain of semiconductor devices.
48#
發(fā)表于 2025-3-29 21:20:56 | 只看該作者
49#
發(fā)表于 2025-3-30 01:29:21 | 只看該作者
https://doi.org/10.1007/978-1-4614-1281-6recent progress in materials with emphasis on composite materials for high-speed VLSI interconnects has been done. Book chapters published in the last 10?years have been reviewed and some earlier book chapters that played an important role in shaping the field of interconnects are included.
50#
發(fā)表于 2025-3-30 06:52:05 | 只看該作者
High Speed Interconnects Made of Composite Materials for VLSI Applicationrecent progress in materials with emphasis on composite materials for high-speed VLSI interconnects has been done. Book chapters published in the last 10?years have been reviewed and some earlier book chapters that played an important role in shaping the field of interconnects are included.
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