| 書目名稱 | Conceptual Design of Multichip Modules and Systems |
| 編輯 | Peter A. Sandborn,Hector Moreno |
| 視頻video | http://file.papertrans.cn/235/234974/234974.mp4 |
| 叢書名稱 | The Springer International Series in Engineering and Computer Science |
| 圖書封面 |  |
| 描述 | .Conceptual Design of Multichip Modules and Systems.treats activities which take place at the conceptual and specificationlevel of the design of complex multichip systems. These activitiesinclude the formalization of design knowledge (information modeling),tradeoff analysis, partitioning, and decision process capture. All ofthese functions occur prior to the traditional CAD activities ofsynthesis and physical design..Inherent in the design of electronic modules are tradeoffs which mustbe understood before feasible technology, material, process, andpartitioning choices can be selected. The lack of a complete set oftechnology information is an especially serious problem in thepackaging and interconnect field since the number of technologies,process, and materials is substantial and selecting optimums isarduous and non-trivial if one truly wants a balance in cost andperformance. Numerous tradeoff and design decisions have to be madeintelligently and quickly at the beginning of the design cycle beforephysical design work begins. These critical decisions, made within thefirst 10% of the total design cycle, ultimately define up to 80% ofthe final product cost...Conceptual Design of Multi |
| 出版日期 | Book 1994 |
| 關(guān)鍵詞 | computer; interconnect; material; modeling; testing |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-1-4757-4841-3 |
| isbn_softcover | 978-1-4419-5137-3 |
| isbn_ebook | 978-1-4757-4841-3Series ISSN 0893-3405 |
| issn_series | 0893-3405 |
| copyright | Springer Science+Business Media New York 1994 |
|Archiver|手機(jī)版|小黑屋|
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