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Titlebook: Computer Vision for Electronics Manufacturing; L. F. Pau Book 1990 Plenum Press, New York 1990 Sensor.Signal.Wafer.algorithms.circuit.comp

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發(fā)表于 2025-3-21 18:35:51 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱Computer Vision for Electronics Manufacturing
編輯L. F. Pau
視頻videohttp://file.papertrans.cn/235/234079/234079.mp4
叢書名稱Advances in Computer Vision and Machine Intelligence
圖書封面Titlebook: Computer Vision for Electronics Manufacturing;  L. F. Pau Book 1990 Plenum Press, New York 1990 Sensor.Signal.Wafer.algorithms.circuit.comp
描述DEFECT PROPORTION OF DETECTION INITIAL RATE DETECTION RATE INSPECTOR 3 COMPLEXITY OF TIMES PAN OF PERFORMING o~ ________________________ o~ ______________________ __ -;. INSPECTION TASK -;. VISUAL INSPECTION Fagure 1. Trends in relations between the complexity of inspection tasks, defect detection rates (absolute and relative), and inspection time. Irrespective of the necessities described above, and with the excep- tion of specific generic application systems (e.g., bare-board PCB inspection, wafer inspection, solder joint inspection, linewidth measure- ment), vision systems are still not found frequently in today‘s electronics factories. Besides cost, some major reasons for this absence are: 1. The detection robustness or accuracy is still insufficient. 2. The total inspection time is often too high, although this can frequently be attributed to mechanical handling or sensing. 3. There are persistent gaps among process engineers, CAD en- gineers, manufacturing engineers, test specialists, and computer vision specialists, as problems dominate the day-to-day interac- tions and prevent the establishment of trust. 4. Computer vision specialists sometimes still believe that their cont
出版日期Book 1990
關(guān)鍵詞Sensor; Signal; Wafer; algorithms; circuit; complexity; computer; computer vision; electronics; image process
版次1
doihttps://doi.org/10.1007/978-1-4613-0507-1
isbn_softcover978-1-4612-7841-2
isbn_ebook978-1-4613-0507-1
copyrightPlenum Press, New York 1990
The information of publication is updating

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Mask Repair and Inspectionen reduced optically and transferred by step-and-repeat procedures to working masks or by direct step-on-wafer machines (DSW) directly onto a wafer. In any case, any flaw, defect, or error in the original reticle or mask is also transferred and will always affect final yield adversely..Typical mask
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Knowledge-Based Processingom artificial intelligence to manipulate and evaluate symbolic information, which is typically of a more qualitative nature (Figure 77). It is not the purpose of this book to present knowledge-based processing in detail; to this end, see Refs. 71–75.
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Image Quantization and Thresholdingis quantization, each digital value will correspond to a range of values .. The number of quantization levels .., ..,…, .., where the .. are the values .(.) may assume, may itself be relatively small or large.
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Book 1990____________ __ -;. INSPECTION TASK -;. VISUAL INSPECTION Fagure 1. Trends in relations between the complexity of inspection tasks, defect detection rates (absolute and relative), and inspection time. Irrespective of the necessities described above, and with the excep- tion of specific generic appli
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SpringerBriefs in Population Studiesso checked. Design-rule-based verification usually relies on local image and electrical operations, process-dependent design rule knowledge bases, and dedicated pipelined parallel architecture hardware.
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