Titlebook: Computer Engineering and Technology; 22nd CCF Conference, Weixia Xu,Liquan Xiao,Zhenzhen Zhu Conference proceedings 2019 Springer Nature Si

gnarled

Background of Financial Instruments,posed ILDR algorithm can apparently reduce network latency and improve network throughput in different experimental traffic patterns. Although the energy consumption is increased, the Energy delay product (EDP) is reduced, so ILDR is a power-efficient solution for 3D NoC.

IRATE

Taxes and Exchange Rates in the EUgorithm while reducing the memory access latency, and greatly reduces the execution time. Then we achieve the zero-copy at the same time. The experimental results show that optimization version has a significant performance improvement, the optimized OpenCL version is up?to 6x comparing with the basic OpenCL version about kernel execution.

修飾

北極人

paltry

An Inter-Layer-Distance Based Routing Algorithm for 3D Network-on-Chip,posed ILDR algorithm can apparently reduce network latency and improve network throughput in different experimental traffic patterns. Although the energy consumption is increased, the Energy delay product (EDP) is reduced, so ILDR is a power-efficient solution for 3D NoC.

牽索

EVICT

A Survey of Approaches for Promoting Honest Recommendations in Reputation Systems,ased incentive schemes. We then survey some representative schemes in the literature belonging to each category, and summarize their unique characteristics and working principles. Moreover, some open problems in each category are also discussed.

不規(guī)則

Design and Application for Sealing of Strengthening Computer for Anti-hard Environment,. In this paper, we analysed the sealing problem of the reinforced computer from the aspects of sealing material selection and sealing structure design. As a result, it is proposed that a solution to the problem of computer sealing against harsh environment. Taking a certain type of reinforced compu

Irrepressible

optic-nerve

An Inter-Layer-Distance Based Routing Algorithm for 3D Network-on-Chip, stacking technology in recent years. It is more difficult to guarantee performance in 3D NoC system than 2D because of stacking dies and the unequal thermal conductance of different logic layers. To ensure the system performance and availability, we proposes an Inter-Layer-Distance based Routing (I