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Titlebook: Compact Models and Performance Investigations for Subthreshold Interconnects; Rohit Dhiman,Rajeevan Chandel Book 2015 Springer India 2015

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21#
發(fā)表于 2025-3-25 03:38:12 | 只看該作者
Soziale Exklusion und Wohlfahrtsstaat,ase in resulting integration density and chip size. The trend toward larger chip size has necessitated using longer interconnects. These connect various components on a very-large-scale integration chip and distribute power, ground, clock, data, and control signals. The performance of a logic gate i
22#
發(fā)表于 2025-3-25 11:29:26 | 只看該作者
23#
發(fā)表于 2025-3-25 12:30:51 | 只看該作者
https://doi.org/10.1007/978-3-531-90499-3OS logic gates. For either an in-phase or out-of-phase transition, the coupling capacitance affects the waveform shape of the output voltage and the propagation delay of each inverter, primarily changing the speed of a CMOS integrated circuit. If one of these CMOS logic gates is quiet, while other l
24#
發(fā)表于 2025-3-25 18:31:36 | 只看該作者
25#
發(fā)表于 2025-3-25 23:52:56 | 只看該作者
26#
發(fā)表于 2025-3-26 01:01:30 | 只看該作者
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發(fā)表于 2025-3-26 05:23:22 | 只看該作者
28#
發(fā)表于 2025-3-26 09:01:45 | 只看該作者
Introduction,cation devices, and a host of many other electronic equipments in the present era. VLSI chips find wide applications in all modern electronic circuits and systems. Further, VLSI technology has reduced the voluminous electronic parts which were used to manufacture early day’s electronic equipment and
29#
發(fā)表于 2025-3-26 14:13:45 | 只看該作者
Design Challenges in Subthreshold Interconnect Circuits,exponential growth of the total number of interconnects/wires as the feature size of MOS transistors decreases in scaled deep submicron CMOS technologies. Interconnect length, however, has not scaled down with feature size and remains long relative to other on-chip geometries. Interconnects are meta
30#
發(fā)表于 2025-3-26 18:46:32 | 只看該作者
Subthreshold Interconnect Circuit Design,ase in resulting integration density and chip size. The trend toward larger chip size has necessitated using longer interconnects. These connect various components on a very-large-scale integration chip and distribute power, ground, clock, data, and control signals. The performance of a logic gate i
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