找回密碼
 To register

QQ登錄

只需一步,快速開始

掃一掃,訪問微社區(qū)

打印 上一主題 下一主題

Titlebook: Compact Models and Performance Investigations for Subthreshold Interconnects; Rohit Dhiman,Rajeevan Chandel Book 2015 Springer India 2015

[復(fù)制鏈接]
樓主: mandatory
21#
發(fā)表于 2025-3-25 03:38:12 | 只看該作者
Soziale Exklusion und Wohlfahrtsstaat,ase in resulting integration density and chip size. The trend toward larger chip size has necessitated using longer interconnects. These connect various components on a very-large-scale integration chip and distribute power, ground, clock, data, and control signals. The performance of a logic gate i
22#
發(fā)表于 2025-3-25 11:29:26 | 只看該作者
23#
發(fā)表于 2025-3-25 12:30:51 | 只看該作者
https://doi.org/10.1007/978-3-531-90499-3OS logic gates. For either an in-phase or out-of-phase transition, the coupling capacitance affects the waveform shape of the output voltage and the propagation delay of each inverter, primarily changing the speed of a CMOS integrated circuit. If one of these CMOS logic gates is quiet, while other l
24#
發(fā)表于 2025-3-25 18:31:36 | 只看該作者
25#
發(fā)表于 2025-3-25 23:52:56 | 只看該作者
26#
發(fā)表于 2025-3-26 01:01:30 | 只看該作者
27#
發(fā)表于 2025-3-26 05:23:22 | 只看該作者
28#
發(fā)表于 2025-3-26 09:01:45 | 只看該作者
Introduction,cation devices, and a host of many other electronic equipments in the present era. VLSI chips find wide applications in all modern electronic circuits and systems. Further, VLSI technology has reduced the voluminous electronic parts which were used to manufacture early day’s electronic equipment and
29#
發(fā)表于 2025-3-26 14:13:45 | 只看該作者
Design Challenges in Subthreshold Interconnect Circuits,exponential growth of the total number of interconnects/wires as the feature size of MOS transistors decreases in scaled deep submicron CMOS technologies. Interconnect length, however, has not scaled down with feature size and remains long relative to other on-chip geometries. Interconnects are meta
30#
發(fā)表于 2025-3-26 18:46:32 | 只看該作者
Subthreshold Interconnect Circuit Design,ase in resulting integration density and chip size. The trend toward larger chip size has necessitated using longer interconnects. These connect various components on a very-large-scale integration chip and distribute power, ground, clock, data, and control signals. The performance of a logic gate i
 關(guān)于派博傳思  派博傳思旗下網(wǎng)站  友情鏈接
派博傳思介紹 公司地理位置 論文服務(wù)流程 影響因子官網(wǎng) 吾愛論文網(wǎng) 大講堂 北京大學(xué) Oxford Uni. Harvard Uni.
發(fā)展歷史沿革 期刊點評 投稿經(jīng)驗總結(jié) SCIENCEGARD IMPACTFACTOR 派博系數(shù) 清華大學(xué) Yale Uni. Stanford Uni.
QQ|Archiver|手機(jī)版|小黑屋| 派博傳思國際 ( 京公網(wǎng)安備110108008328) GMT+8, 2025-10-19 22:55
Copyright © 2001-2015 派博傳思   京公網(wǎng)安備110108008328 版權(quán)所有 All rights reserved
快速回復(fù) 返回頂部 返回列表
鹰潭市| 滨海县| 高台县| 中超| 遂溪县| 崇明县| 肃北| 华阴市| 应城市| 玉山县| 韶山市| 平湖市| 漠河县| 鄂托克前旗| 石泉县| 石门县| 阿城市| 南木林县| 定结县| 东乌| 赣州市| 信宜市| 湟中县| 南京市| 尉氏县| 陵水| 松江区| 申扎县| 淮滨县| 礼泉县| 富阳市| 岳阳市| 沾益县| 康平县| 新津县| 白沙| 威远县| 丰镇市| 新沂市| 普兰店市| 石楼县|