Titlebook: Carbon Nanotubes for Interconnects; Process, Design and Aida Todri-Sanial,Jean Dijon,Antonio Maffucci Book 2017 Springer International Pub

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terconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.978-3-319-80642-6978-3-319-29746-0

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Overview of Carbon Nanotube Interconnectsas a core and foundation of the electronic information technology has a great influence on the daily life of human being. The semiconductor technology and IC industry have become an important symbol to embody a country’s comprehensive scientific and technological capability. In order to improve circ

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Computational Studies of Thermal Transport Properties of Carbon Nanotube Materialshe complex and inherently multiscale nature of the structural organization of the CNT network materials necessitates combination of atomistic and mesoscopic simulation techniques which provide complementary information on different aspects of the heat transfer in CNT materials and facilitate the dev

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Carbon Nanotubes as Microbumps for 3D Integration enabling future electronics to be consistent with future component, system, and circuit board (or global-level) requirements. Moreover, assembly approaches are moving toward heterogeneous three-dimensional integrated circuits (3D ICs) with silicon via wafer thinning, bonding technologies, and 3D sy