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Titlebook: CHIPS 2020 VOL. 2; New Vistas in Nanoel Bernd H?fflinger Book 2016 Springer International Publishing Switzerland 2016 3D Integration of Nan

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發(fā)表于 2025-3-21 18:28:27 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱CHIPS 2020 VOL. 2
副標(biāo)題New Vistas in Nanoel
編輯Bernd H?fflinger
視頻videohttp://file.papertrans.cn/221/220275/220275.mp4
概述Covers the latest milestones in Nano electronics supporting the messages of the book.Represents an extension of the book CHIPS 2020 in attractive style.Contains contributions of world leaders.Includes
叢書名稱The Frontiers Collection
圖書封面Titlebook: CHIPS 2020 VOL. 2; New Vistas in Nanoel Bernd H?fflinger Book 2016 Springer International Publishing Switzerland 2016 3D Integration of Nan
描述.The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020..The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising? Moore-like exponential growth sustainable through to the 2030s..
出版日期Book 2016
關(guān)鍵詞3D Integration of Nanodevices; Analog-digital Converters; Developments in Micro- and Nanoelectronics; D
版次1
doihttps://doi.org/10.1007/978-3-319-22093-2
isbn_softcover978-3-319-36609-8
isbn_ebook978-3-319-22093-2Series ISSN 1612-3018 Series E-ISSN 2197-6619
issn_series 1612-3018
copyrightSpringer International Publishing Switzerland 2016
The information of publication is updating

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The Future of Low-Power Electronics,power dissipation. The future IT and electronics, therefore, require more efficient power-reduction solutions. In the human brain and nerve system, analog signals from sensing orgasms are processed by a network composed of neurons and synapses. This process is slow but very power-efficient because i
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Monolithic 3D Integration, the integration of transistors in the 3rd dimension on top of each other, maintaining and using the quality of monolithic, crystalline silicon in all successive transistor layers. After decades of exploratory research, monolithic 3D integration is now ready for cost-effective, large-scale implement
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News on Energy-Efficient Large-Scale Computing,neers to perform new ground-breaking research with every new generation of supercomputer in important fields like: renewable energy, climate prediction, drug development, genetics and weather prediction. Every field of science and engineering (and all that entails to the welfare of the inhabitants o
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