Titlebook: Bio and Nano Packaging Techniques for Electron Devices; Advances in Electron Gerald Gerlach,Klaus-Jürgen Wolter Book 2012 Springer-Verlag B

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3D Designntain the validity of Moore’s law in today’s nano era. In this chapter, an overview of technologies and physical design in the new 3-dimensional context is presented. A survey of modern 3D integration technologies, such as 3D packages and 3D integrated circuits, is given first. The author then inves

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Uncertainty-Based Design Optimization of MEMS/NEMSrking principles and the manufacturing technology associated with high initial costs for experimental investigations. Uncertainty-based design optimization enables stochastic variables, such as scattering material properties, manufacturing tolerances, stochastic time dependent loads, aging, or wear,

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Physical Effects of Nanoparticles and Nanoparticle Ensembles: Impact to System Packagings are right at the edge to enter market-relevant products in medicine and biology, but equally be applied in many inorganic and semiconducting devices. The driving force to take profit from such confined nanomaterials though, might have very different origins, may it be the novelty and challenging n

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