Titlebook: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics; G. Q. Zhang,L. J. Ernst,O. Saint Leger Book 2000 Springer Science+

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https://doi.org/10.1007/978-1-4757-5462-9aporization during reflow, the representative volume element (RVE) approach, by which the micro-void effect can be taken into consideration, is introduced in this paper. A theoretical model is established to calculate the whole-field vapor pressure in plastic materials. FEA models are built for both

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Infinite Group Actions on Polyhedratheoretical investigations of stresses within electronic material compounds induced by environmental conditions, especially temperature changes, require both the characterization of materials properties and materials interface properties. Measurement results on typical commercially available electro

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銼屑

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Morse Theory and Bestvina–Brady Groupsexploited more efficiently by using mathematical optimization methods. This enables the designer to optimize products and processes. We describe two ways of simulation-based optimization and discuss the advantages and disadvantages of both methods.

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colloquial

出血

https://doi.org/10.1007/978-1-4612-0385-8view of presently available material models is presented. In particular a cure dependent linear-viscoelastic model is discussed more in detail. With this model the investigation of processing induced stress fields during and after fabrication is possible.

違反

Morse Theory and Bestvina–Brady Groupsexploited more efficiently by using mathematical optimization methods. This enables the designer to optimize products and processes. We describe two ways of simulation-based optimization and discuss the advantages and disadvantages of both methods.

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