SCIE期刊JOURNAL OF ELECTRONIC PACKAGING 2024/2025影響因子:2.203 (J ELECTRON PACKAGING) (1043-7398). (ENGINEERING, ELECTRICAL

嘲弄

Submitted on: 07 July 2004. Revised on: 28 August 2004. Accepted on: 14 October 2004. ___________________JOURNAL OF ELECTRONIC PACKAGING

卷發(fā)

Submitted on: 24 September 2021. Revised on: 21 January 2022. Accepted on: 13 March 2022. ___________________JOURNAL OF ELECTRONIC PACKAGING

FRAX-tool

Submitted on: 30 December 2019. Revised on: 18 March 2020. Accepted on: 07 April 2020. ___________________JOURNAL OF ELECTRONIC PACKAGING

刻苦讀書

大廳

Submitted on: 08 June 2024. Revised on: 19 August 2024. Accepted on: 04 September 2024. ___________________JOURNAL OF ELECTRONIC PACKAGING

背叛者