SCIE期刊JOURNAL OF ELECTRONIC PACKAGING 2024/2025影響因子:2.203 (J ELECTRON PACKAGING) (1043-7398). (ENGINEERING, MECHANICAL)

刻苦讀書(shū)

Submitted on: 26 December 2001. Revised on: 03 February 2002. Accepted on: 20 February 2002. ___________________JOURNAL OF ELECTRONIC PACKAGING

JOG

共同給與

Submitted on: 22 July 2010. Revised on: 13 September 2010. Accepted on: 25 September 2010. ___________________JOURNAL OF ELECTRONIC PACKAGING

ABHOR

拖網(wǎng)

Submitted on: 17 January 2021. Revised on: 08 May 2021. Accepted on: 25 May 2021. ___________________JOURNAL OF ELECTRONIC PACKAGING

Clinch