Titlebook: Advances in Electronic Circuit Packaging; Volume 3 Lawrence L. Rosine (Editor, EDN (Electrical Design Book 1963 Springer Science+Business M

GLADE

Matthew N. Hansen,Jeffrey D. Clogstonbased on the theory of single-pass air-cooled heat exchangers with uniform heat flux for laminar and turbulent flow. General expressions are derived which predict the amount of cooling air required on a normalized basis as a function of parameters such as average package “filling factor” for both th

原告

不如屎殼郎

https://doi.org/10.1007/978-1-4939-7352-1 microelectronic hardware with maximum efficiency. Included in the presentation is a review of thin-film processes, discussions of the basic packaging system and logic circuitry, as well as consideration of pertinent environmental factors.

孵卵器

The Minerals, Metals & Materials SeriesThis paper describes a balanced design approach established at the Electronic Systems and Products Division of the Martin Company. Included are several economic evaluations to illustrate the advantage in using this approach during the design phase.

BATE

https://doi.org/10.1007/978-3-031-22576-5This paper describes a design program to achieve flexible and pleasing control/display panel packaging for the Ballistic Missile Early Warning System at Thule, Greenland. The object is to provide an optimum combination of initial cost, cost to change, and packing factor in the equipment consoles.

Finasteride

The Minerals, Metals & Materials SeriesThis paper discusses a new high-speed, completely transistorized, airborne digital data processor, designed and manufactured at the General Electric Light Electronics Department for the AEW control system of the Grumman W2F-1 Hawkeye aircraft.

消息靈通

Guangheng Ji,Xu Gao,Wanlin WangThis paper will describe a packaging concept aimed at achieving component densities higher than with normal “l(fā)aydown” techniques; providing for ease of engineering-change activity; automated assembly; and utilizing both welded and soldered connections. There was no direct attempt at miniaturization.

adipose-tissue

https://doi.org/10.1007/978-3-031-50304-7This paper describes a prefabricated weldable circuitry, Intercon, capable of use at all three packaging levels. A series of figures illustrates the various applications of Intercon.

agenda

Knowledge Generating Experiments,This paper deals with the effects of ambient air density on the weightflow of air delivered by an air moving device to a package requiring cooling, and shows the way in which this change in weightflow governs the component temperature rise above ambient temperature. A typical example indicating the use of the contained information is presented.

explicit