Titlebook: Advances in Electronic Circuit Packaging; Volume 3 Lawrence L. Rosine (Editor, EDN (Electrical Design Book 1963 Springer Science+Business M

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https://doi.org/10.1007/978-1-4899-7309-2circuit; electronic circuit; electronics

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Overview: 978-1-4899-7296-5978-1-4899-7309-2

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Xin Ren,Kai Dong,Rong Zhu,Lingzhi YangC (.module Digital Processor And Computer). As a by-product of the MICROPAC program, equipment design techniques for the economical mounting and interconnection of and heat transfer from digital micromodules have been developed and are described herein. It is shown that the circuitry booklet techniq

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https://doi.org/10.1007/978-3-030-99881-3of ?34° to 150°C and a typical package, 12 by 8 by 6 in., were used. Containers should be fabricated from wrought metals drawn to shape or machined from a solid wrought block. If joints are welded, the materials should be carefully selected to minimize porosity and the development of residual stress