Titlebook: Advanced Thermal Management Materials; Guosheng Jiang,Liyong Diao,Ken Kuang Book 2013 Springer Science+Business Media New York 2013 Alumin

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Sie schreiben einen Namen in den Himmel,mal management materials. Next, we will present thermal management materials with an Al–Cu matrix and particle-enhanced materials such as W, Mo, SiC, AlN, BeO, Si, and others with a low coefficient of expansion. The materials covered include WCu, MoCu, AlSiC, Cu/SiC, Cu/Si, and negative thermal expa

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https://doi.org/10.1007/978-3-531-92807-4introduce manufacturing technologies such as high-temperature liquid-phase sintering, reactive sintering, and infiltration. Then we will introduce CMC/CPC composite manufacturing technologies such as hot rolling lamination, explosive forming, and laser cladding. Finally, we will discuss the WCu and

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