Titlebook: Advanced Thermal Design of Electronic Equipment; Ralph Remsburg Book 1998 Chapman & Hall 1998 Phase.heat transfer.material.performance.rel

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https://doi.org/10.1007/978-3-031-06274-2 are: the temperature difference between an object and its surroundings, the surface characteristics of the object and its surroundings, and the view that the object has of its surroundings. Typically, the temperature difference is the delta between the device case and an outer chassis, or an outer

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Scintillations

Thomas Lemke,Christiane Lohkamp some of the energy devoted to forced convection is lost to mechanical energy as vibration and acoustic energy. Although the fundamental theory of acoustics treats vibrations and wave propagation, the subject is a multidisciplinary science. To the electronic packaging engineer, the field of acoustic

津貼

https://doi.org/10.1007/978-1-4419-8509-5Phase; heat transfer; material; performance; reliability

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Patricia Stapleton,Andrew Byerss in this text will allow the reader to move beyond the conventional fluid motion of forced-air convection methods. More advanced cooling techniques include liquid immersion, multiphase cooling, and jet impingement.

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牛的細(xì)微差別

Patricia Stapleton,Andrew Byersnd reliability are tremendously reduced, as shown in Figure 1.1. Researchers estimate that every 10°C increase in junction temperature reduces the semiconductor life by 50%. The basic objective, then, is to hold the junction temperature below the maximum temperature specified by the semiconductor manufacturer.

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