| 期刊全稱(chēng) | A Guide to Lead-free Solders | | 期刊簡(jiǎn)稱(chēng) | Physical Metallurgy | | 影響因子2023 | John W. Evans,Werner Engelmaier (Engelmaier Associ | | 視頻video | http://file.papertrans.cn/141/140958/140958.mp4 | | 發(fā)行地址 | Covers all aspects of lead-free solders from physical properties to product assurance.The reader will be able to choose new solders more suitable to the climate of legislation and public opinion based | | 圖書(shū)封面 |  | | 影響因子 | The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment will require all companies doing business in the EU to transition to lead-free. Compliance with forthcoming lead-free regulations will ultimately fall to individual companies and the engineers responsible for design and prod- tion of electronic products and they must be prepared with adequate knowledge of the materials that are leading candidates and they must be prepared to fill the gaps in the data base for their own products. Research worldwide over the past 10 years has produced data and direction for choosing an alloy to substitute for near-eutectic SnPb alloys. This book will provide a valuable resource for engineers involved in the transition to products. Basic theory is presented on the physical metallurgy of soldering technology including elements of assembly, surface finishes and solder-paste technology, wetting and solidification, microstructural instability and intermetallic c- pounds and mechanical, creep and fatigue behavior. Tech | | Pindex | Book 2007 |
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